Electrical Engineer Signal Integrity and Power Integrity Technical Lead

Job Type: Location Type: Not Specified

 

Job Overview

Advantest America, a leading Semiconductor Test and Measurement Company, is seeking innovative and self-driven individuals to join our US Research & Venture Team. This team is part of a global initiative to integrate advances in electrical, mechanical, thermal, software, and AI/Machine Learning technologies into our test and measurement solutions across the semiconductor value chain.

We are seeking a highly experienced Electrical Engineer to perform a broad range of complex engineering functions related to the design, testing, and evaluation of electrical, optical, and thermal systems for semiconductor testing. This includes systems with semiconductors, photonics, and embedded devices. As an SI and PI Engineering Lead on the Research & Venture Team you will work collaboratively with other Advantest technology groups, Business Units, partners, and suppliers to develop and integrate advanced electrical, optical and mechanical technologies into Advantest’s automated test systems.

Your responsibilities will include conducting feasibility studies, developing engineering prototypes and testing new and modified designs. You will be assigned independent electrical and system design projects, allowing for innovation and technical leadership. You will be involved in product development teams, providing direction and training to junior staff and contractors. Additionally, you may address field issues and provide guidance to field teams.

This position is based at our headquarters in San Jose, CA, and requires periodic travel for customer visits and collaboration.

Responsibilities and Duties

• Develop and implement SI and PI (PDN, DC and AC) designs for new semiconductor test systems and components, including PCBA, Load Board and sockets. Target devices include high performance computing, AI and graphics devices with data rates of 64Gb/s and beyond.
• Perform Signal Integrity and Power Integrity design and analysis of entire channel: including package, sockets, interposers, PCBA load board, cables.
• Conduct integration testing, qualifications, and hands-on evaluation of prototype systems and sub-assemblies.
• Create and manage test specifications and evaluation protocols, initiate engineering change order requests.
• Interpret functional test results and present findings to senior staff.
• Present designs during design and customer reviews.
• Collaborate with manufacturing, quality assurance, and technical support teams to establish functional specifications and select suppliers for components and assemblies.
• Provide guidance to lower-level staff, recommending and designing innovations, improved methods, tools, and processes.
• Participate in the preparation of patent applications and memos of invention for trade secrets.
• Act as a customer contact on selective technical matters and analyze customer requirements.
• Identify risk areas and optimization opportunities.
• Take on project ownership and management; determine technology requirements and develop strategies.
• Drive design completion, provide design inputs, and work closely with external technology partners on projects.
• Create test plans, procure necessary collaterals, and oversee test execution.
• Maintain project schedules, including keeping the Gantt chart current and ensuring effective handoffs to Applications, Design, and Manufacturing.
• Conduct top-level tolerance analysis and function as an expert consultant when needed.
• May be assigned independent mechanical design projects and all other duties and tasks as required.

Qualifications

Required

• BS in Electrical Engineering; MS in Electrical Engineering preferred.
• BS + 10 years min or MS + 7 years min
• Expert level knowledge of
  • High speed signal and Power integrity requirements and design at PCB, Package and system level.
  • High speed channel simulation tools such as ADS, HFSS, CST
  • S-parameter modeling and simulations
  • High speed SERDES (Tx and Rx equalization)
  • High speed data communications (eye diagrams, BER testing)
  • High speed serial protocols (such as PCIe,) and verification testing
  • PDN/Power Integrity (AC and DC) Design and Analysis at PCB and package level for high performance compute, AI and Graphics devices (featuring high power consumption and pin count).
• Experienced with use of relevant lab instruments (high speed oscilloscopes, VNA, TDR, spectrum analyzer, Protocol Analyzers.
• Practical knowledge of PCB construction, properties, and effect of PCB materials on signal quality.
• Excellent teamwork and interpersonal skills; ability to work as part of a multi-disciplinary team (HW, ASIC, SW and Mechanical design engineers)
• Strong analysis and synthesis capabilities.
• Excellent verbal and written communication skills, alongside strong interpersonal and organizational abilities.
• Competent in multitasking, prioritizing, and managing time effectively.
• Ability to travel as required.

Desired

• MS in Electrical Engineering.
• Experience with photonics and optical signaling
• Experience with designing, certifying, and deploying semiconductor capital equipment.
• Ability to work in cross-functional teams building complex test systems.
• Intermediate software skills, including experiment instrumentation and execution (meters, power supplies).
• Ability to read, write, and speak Japanese.